The Application of the Modified Electrostatic Model to the Diffusion of 3d-Impurities in Copper

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Periodical:

Defect and Diffusion Forum (Volumes 143-147)

Edited by:

H. Mehrer, Chr. Herzig, N.A. Stolwijk, H. Bracht

Pages:

137-142

DOI:

10.4028/www.scientific.net/DDF.143-147.137

Citation:

G. Neumann et al., "The Application of the Modified Electrostatic Model to the Diffusion of 3d-Impurities in Copper", Defect and Diffusion Forum, Vols. 143-147, pp. 137-142, 1997

Online since:

January 1997

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$35.00

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