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HomeDefect and Diffusion ForumDefect and Diffusion Forum Vols. 143-147A new Insight into the Electromigration Behavior...

A new Insight into the Electromigration Behavior of Copper Interconnects: The Roles of Grain Boundary and Surface Diffusion

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Diffusion in Materials DIMAT 1996

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Periodical:

Defect and Diffusion Forum (Volumes 143-147)

Pages:

1673-1678

DOI:

https://doi.org/10.4028/www.scientific.net/DDF.143-147.1673

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Cite this paper

Online since:

January 1997

Authors:

Evgeny E. Glickman, M. Nathan

Keywords:

Copper (Cu), Diffusion, Electromigration, Grain Boundary, Grooving, Surface

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© 1997 Trans Tech Publications Ltd. All Rights Reserved

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