A new Insight into the Electromigration Behavior of Copper Interconnects: The Roles of Grain Boundary and Surface Diffusion

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Periodical:

Defect and Diffusion Forum (Volumes 143-147)

Edited by:

H. Mehrer, Chr. Herzig, N.A. Stolwijk, H. Bracht

Pages:

1673-1678

DOI:

10.4028/www.scientific.net/DDF.143-147.1673

Citation:

E. E. Glickman and M. Nathan, "A new Insight into the Electromigration Behavior of Copper Interconnects: The Roles of Grain Boundary and Surface Diffusion", Defect and Diffusion Forum, Vols. 143-147, pp. 1673-1678, 1997

Online since:

January 1997

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$38.00

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