Phase Growth Between Copper and Different Tin Solders

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Periodical:

Defect and Diffusion Forum (Volumes 143-147)

Edited by:

H. Mehrer, Chr. Herzig, N.A. Stolwijk, H. Bracht

Pages:

579-584

DOI:

10.4028/www.scientific.net/DDF.143-147.579

Citation:

S. Däbritz et al., "Phase Growth Between Copper and Different Tin Solders", Defect and Diffusion Forum, Vols. 143-147, pp. 579-584, 1997

Online since:

January 1997

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Price:

$35.00

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