Electromigration, Effect of Grain-Boundary Diffusion Anisotropy upon Via Electromigration Failure
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a.441
Effects of Grain Structure and Grain Growth upon Electromigration
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a.442
Physical Metallurgy of Electromigration
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a.443
Point Defects, Cell Model for Interstitials in Binary Substitutional Solutions
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a.444
Theory of Huang X-Ray Scattering Caused by Point Defects
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a.445
Tight-Binding Molecular Dynamics Simulations of Semiconductor Alloys
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Elastic Force on a Point Defect in or Near to a Surface Layer
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a.447
Average Gibbs Energy per Lattice Defect
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a.448
Negative-U Centers and Defect Superconductivity
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a.449
Theory of Huang X-Ray Scattering Caused by Point Defects
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