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HomeDefect and Diffusion ForumDefect and Diffusion Forum Vols. 194-199Electromigration Kinetics in Thin Film...

Electromigration Kinetics in Thin Film Interconnects: Electro-Transport Coupled to Diffusional Creep

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Diffusion in Materials DIMAT2000

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Periodical:

Defect and Diffusion Forum (Volumes 194-199)

Pages:

1417-1430

DOI:

https://doi.org/10.4028/www.scientific.net/DDF.194-199.1417

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Online since:

April 2001

Authors:

Evgeny E. Glickman, M. Nathan

Keywords:

Diffusional Creep, Drift Velocity Electromigration, Hillocks, Kinetics and Threshold, Short Stripe Effect, Stress Build-up and Relaxation, Viscosity

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© 2001 Trans Tech Publications Ltd. All Rights Reserved

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