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HomeDefect and Diffusion ForumDefect and Diffusion Forum Vols. 194-199Bulk and Grain Boundary Diffusion in Intermetallic...

Bulk and Grain Boundary Diffusion in Intermetallic Compounds of the Systems Ni-Al and Ti-Al

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Diffusion in Materials DIMAT2000

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Periodical:

Defect and Diffusion Forum (Volumes 194-199)

Pages:

317-336

DOI:

https://doi.org/10.4028/www.scientific.net/DDF.194-199.317

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Online since:

April 2001

Authors:

Christian Herzig, Sergiy V. Divinski, St. Frank, T. Przeorski

Keywords:

Bulk Diffusion, Diffusion Mechanism, Grain Boundary Diffusion, Ni₃Al, NiAl, Ordered Intermetallics, Ti₃Al, TiAl

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© 2001 Trans Tech Publications Ltd. All Rights Reserved

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