How High Pressures can be Involved in Chemical Bonding

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Periodical:

Defect and Diffusion Forum (Volumes 208-209)

Edited by:

W. Lojkowski

Pages:

85-94

DOI:

10.4028/www.scientific.net/DDF.208-209.85

Citation:

G. Demazeau "How High Pressures can be Involved in Chemical Bonding", Defect and Diffusion Forum, Vols. 208-209, pp. 85-94, 2002

Online since:

May 2002

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$35.00

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