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3D-Simulation of Void Formation, Growth and Migration under Electromigration

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Abstract:

The 3D Monte Carlo scheme is proposed for simulation of simultaneous self-consistent current redistribution, surface diffusion, drift and void migration and coalescence at the interface metal/dielectric. Results of simulation as well as simple phenomenological model demonstrate a possibility of trapping at and migration along the grainboundaries (GBs). Critical size of “detrapping” after coalescence has been estimated.

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Periodical:

Defect and Diffusion Forum (Volumes 237-240)

Pages:

1306-1311

DOI:

https://doi.org/10.4028/www.scientific.net/DDF.237-240.1306

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Online since:

April 2005

Authors:

T.V. Zaporozhets, I.V. Sobchenko, Andriy Gusak

Keywords:

Electromigration, Electron Wind, Failure, Grain Boundary, Monte-Carlo Simulation, Surface Void

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© 2005 Trans Tech Publications Ltd. All Rights Reserved

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