3D-Simulation of Void Formation, Growth and Migration under Electromigration

Abstract:

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The 3D Monte Carlo scheme is proposed for simulation of simultaneous self-consistent current redistribution, surface diffusion, drift and void migration and coalescence at the interface metal/dielectric. Results of simulation as well as simple phenomenological model demonstrate a possibility of trapping at and migration along the grainboundaries (GBs). Critical size of “detrapping” after coalescence has been estimated.

Info:

Periodical:

Defect and Diffusion Forum (Volumes 237-240)

Edited by:

M. Danielewski, R. Filipek, R. Kozubski, W. Kucza, P. Zieba, Z. Zurek

Pages:

1306-1311

DOI:

10.4028/www.scientific.net/DDF.237-240.1306

Citation:

T.V. Zaporozhets et al., "3D-Simulation of Void Formation, Growth and Migration under Electromigration", Defect and Diffusion Forum, Vols. 237-240, pp. 1306-1311, 2005

Online since:

April 2005

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Price:

$35.00

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