3D-Simulation of Void Formation, Growth and Migration under Electromigration
The 3D Monte Carlo scheme is proposed for simulation of simultaneous self-consistent current redistribution, surface diffusion, drift and void migration and coalescence at the interface metal/dielectric. Results of simulation as well as simple phenomenological model demonstrate a possibility of trapping at and migration along the grainboundaries (GBs). Critical size of “detrapping” after coalescence has been estimated.
M. Danielewski, R. Filipek, R. Kozubski, W. Kucza, P. Zieba, Z. Zurek
T.V. Zaporozhets et al., "3D-Simulation of Void Formation, Growth and Migration under Electromigration", Defect and Diffusion Forum, Vols. 237-240, pp. 1306-1311, 2005