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HomeDefect and Diffusion ForumDefect and Diffusion Forum Vols. 237-240Diffusion-Controlled Liquid Bismuth Induced...

Diffusion-Controlled Liquid Bismuth Induced Intergranular Embrittlement of Copper

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Abstract:

The consequences of the contact between liquid bismuth and a copper bicrystal are investigated at 500°C. Atoms of bismuth are shown to penetrate and embritlle the copper grain boundary. Grain boundary concentration profiles of bismuth are obtained on fracture surfaces by both Auger electron spectroscopy and He4+ Rutherford backscattering spectroscopy. The maximum bismuth intergranular concentration is calculated from experimental data to be about 1.7 monolayers (near the liquid bismuth / solid copper interface). The overall profiles are significantly different from typical erfc profiles and an interpretation is proposed, based on the coupling effect between grain boundary diffusion and non-linear segregation. These results allow us to conclude on the absence of grain boundary wetting for the Cu / Bi system at 500°C.

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Diffusion in Materials - DIMAT2004

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Periodical:

Defect and Diffusion Forum (Volumes 237-240)

Pages:

683-688

DOI:

https://doi.org/10.4028/www.scientific.net/DDF.237-240.683

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Online since:

April 2005

Authors:

V. Laporte, Krzysztof Wolski, Pascal Berger, A. Terlain, Gerard Santarini

Keywords:

Auger Electron Spectroscopy (AES), Grain Boundary Diffusion, Grain Boundary Wetting, Liquid Bismuth System, Liquid Metal Embrittlement LME, Non Linear Segregation, Rutherford Backscattering Spectroscopy RBS, Solid Copper

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© 2005 Trans Tech Publications Ltd. All Rights Reserved

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