Phenomenological Model for Creep Behaviour in Cu-8.5at%Al Alloy

M. Abo-Elsoud

doi:10.4028/www.scientific.net/DDF.251-252.89

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HomeDefect and Diffusion ForumDefect and Diffusion Forum Vols. 251-252Phenomenological Model for Creep Behaviour in...

Phenomenological Model for Creep Behaviour in Cu-8.5at%Al Alloy

Abstract:

Creep experiments were conducted on Cu-8.5at.% Al alloy in the intermediate temperature range from 673 to 873K, corresponding to 0.46-0.72 Tm where Tm is the absolute melting temperature. The present analysis reveals the presence of two distinct deformation regions (climb and viscous glide) in the plot of log ε vs. log σ. The implications of these results on the transition from powerlaw to exponential creep regime are examined. The results indicated that the rate controlling mechanism for creep is the obstacle-controlled dislocation glide. A phenomenological model is proposed which assumes that cell boundaries with sub-grains act as sources and obstacles to gliding dislocations.

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Defect and Diffusion Forum (Volumes 251-252)

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89-96

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https://doi.org/10.4028/www.scientific.net/DDF.251-252.89

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Online since:

March 2006

Authors:

M. Abo-Elsoud

Keywords:

Activation Energy, Cell Boundaries, Creep Test, Internal Stress, Migration Energy, Stress Exponent, Volume Fraction

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