Surface Microstructural Evolution up to Creep Rupture under the Power-Law Regime in Cu-8.5at%Al Alloy at Intermediate Temperatures

M. Abo-Elsoud

doi:10.4028/www.scientific.net/DDF.251-252.97

Paper Titles

Slow Positron Studies of Defects in Si-Doped GaAs
p.51

Six-Jump-Cycle Mechanism for Collective Correlations in Nonstoichiometric Intermetallic Compounds
p.59

Vacancy-Wind Factors and Collective Correlation Factors in Nonstoichiometric B2 Intermetallic Compounds
p.69

Defect Densities Using the Positron Annihilation Doppler Broadening Technique in Wrought Alloys 3003 and 3005
p.79

Phenomenological Model for Creep Behaviour in Cu-8.5at%Al Alloy
p.89

Surface Microstructural Evolution up to Creep Rupture under the Power-Law Regime in Cu-8.5at%Al Alloy at Intermediate Temperatures
p.97

Effect of γ-Irradiation on the Mechanical Properties of Al-Cu Alloy
p.105

On the Physics of the Anomalous Characteristics of Fickian Diffusion of Fe and Other Transition-Element Impurities in Crystalline Al at Elevated Temperatures
p.111

On the Physics of Enhanced Fickian Diffusion and Structural-Phase Changes in Intensively Deforming Metallic Materials
p.123

HomeDefect and Diffusion ForumDefect and Diffusion Forum Vols. 251-252Surface Microstructural Evolution up to Creep...

Surface Microstructural Evolution up to Creep Rupture under the Power-Law Regime in Cu-8.5at%Al Alloy at Intermediate Temperatures

Abstract:

Micro-structural change caused by the corresponding change in creep properties of Cu-8.5at.%Al alloy was studied. It was found that a micro-structural observations reveal the formation of different types of defect features during creep of the investigated alloy at intermediate temperatures between 0.46-0.72Tm, where Tm is the absolute melting point. SEM was used to characterize the studied alloy by quantitative micro-analysis. It allowed the observer to defect the micro-structural features such as dislocation that were generated from deformation and could move interagranularly by glide and climb. Clearly, the development of this microstructure could be attributed to the grain refining effect of the Al indicating the role of the applied stress at this alloy. The results show that the creep rupture strength of Cu-8.5at.%Al alloy in the power law creep damage mechanism. This due to the constraint introduced on the matrix creep flow by the Al phase rather than the devolvement of high threshold stress values. While the increase in the length of Al filaments and reduction in interfilament spacing with increasing draw ratio increase the constraint on the creep flow of the matrix, they also enhance the creep damage caused by the diffusion mechanisms because of the easy diffusion paths along the Al filaments and the reduction in the matrix grain size.