Isothermes of Grain Boundary Tension and Grain Boundary Adsorption in Cu-Sn System

Abstract:

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Grain boundary surface tension and surface tension of free surface for pure copper and copper-tin alloys are measured. On the base of these data isothermes of grain boundary tension, free surface tension and isothermes of adsorption are constructed in assumption of a dilute solution.

Info:

Periodical:

Defect and Diffusion Forum (Volumes 258-260)

Edited by:

Andreas Öchsner and José Grácio

Pages:

427-432

DOI:

10.4028/www.scientific.net/DDF.258-260.427

Citation:

D. V. Vaganov and S. N. Zhevnenko, "Isothermes of Grain Boundary Tension and Grain Boundary Adsorption in Cu-Sn System", Defect and Diffusion Forum, Vols. 258-260, pp. 427-432, 2006

Online since:

October 2006

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Price:

$35.00

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