Isothermes of Surface and Grain Boundary Tension of Cu-Based Alloys with Sb, Sn, In

Abstract:

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Grain boundary and surface tension for pure copper and copper-based alloys with Sb, Sn and In are measured by zero creep method. On the base of these and literature data, using the Shyshkovsky equation for a dilute solution, the isothermes of surface tension and grain boundary tension are constructed in Cu-based alloys with Sb, Sn, In and also Bi and Au. It is shown that all solutes are active on the surface tension of copper. The free energies of adsorption are negative and decrease in a following consequence: Bi, Sb, Sn, In, and Au.

Info:

Periodical:

Defect and Diffusion Forum (Volumes 273-276)

Edited by:

Andreas Öchsner and Graeme E. Murch

Pages:

608-615

DOI:

10.4028/www.scientific.net/DDF.273-276.608

Citation:

E. I. Gershman and S. N. Zhevnenko, "Isothermes of Surface and Grain Boundary Tension of Cu-Based Alloys with Sb, Sn, In", Defect and Diffusion Forum, Vols. 273-276, pp. 608-615, 2008

Online since:

February 2008

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$35.00

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