Isothermes of Surface and Grain Boundary Tension of Cu-Based Alloys with Sb, Sn, In

Evgeny I. Gershman; Sergei Zhevnenko

doi:10.4028/www.scientific.net/DDF.273-276.608

Paper Titles

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Effect of Sodium Borohydride on the Hydrogen Diffusion in MmNi_3.6Mn_0.4Al_0.3Co_0.7 Hydride Electrode
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Wagnerian Scaling Diffusion Kinetics
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On the Features of Ultramicroelectrodes
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Isothermes of Surface and Grain Boundary Tension of Cu-Based Alloys with Sb, Sn, In
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Simplification of Ensemble Averaged Two-Phase Flow with Heat and Mass Transfer Equations for Boiling in a Channel
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Microstructure Evaluation of Solid-Solution in Fe-Cu Immiscible Alloy System
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Synthesis of ZnO Nanoparticles via Sol-Gel Process Using Triethanolamine as a Novel Surfactant
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MnO-C Interaction – Thermodynamic Modelling of Phase Equilibria
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Isothermes of Surface and Grain Boundary Tension of Cu-Based Alloys with Sb, Sn, In

Abstract:

Grain boundary and surface tension for pure copper and copper-based alloys with Sb, Sn and In are measured by zero creep method. On the base of these and literature data, using the Shyshkovsky equation for a dilute solution, the isothermes of surface tension and grain boundary tension are constructed in Cu-based alloys with Sb, Sn, In and also Bi and Au. It is shown that all solutes are active on the surface tension of copper. The free energies of adsorption are negative and decrease in a following consequence: Bi, Sb, Sn, In, and Au.