Reaction Diffusion in Pb Free Solder-Cu System

O. Taguchi; C.G. Lee; D.Y. Park; G.S. Shin; Shigeru Suzuki; Ryusuke Nakamura

doi:10.4028/www.scientific.net/DDF.297-301.796

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HomeDefect and Diffusion ForumDefect and Diffusion Forum Vols. 297-301Reaction Diffusion in Pb Free Solder-Cu System

Reaction Diffusion in Pb Free Solder-Cu System

Abstract:

Reaction diffusion in liquid Pb free solder- and solid Pb free solder- pure Cu systems has been investigated in the temperature range between 397 K and 563 K. The Pb free solder of which composition is 95.7 mass% Sn, 2.8 mass% Ag, 1.0 mass% Bi and 0.5 mass% Cu and 99.99 mass% oxygen free Cu has been used. In the liquid Pb free solder-pure Cu system, as soon as the solder melted down, an intermetallic compound phase formed preferentially, and grew with increasing diffusion time. Only the phase exists in the experimental time up to 120 seconds. The layer thickness of the phase obeyed the parabolic law. On the other hand, in the solid Pb free solder-pure Cu system two intermetallic compounds  phase and ’ phase form and grew with increasing diffusion time, although the  phase forms after an incubation time at low temperature. The layer thickness of these intermetallic compounds obeyed the parabolic law. The growth rate of ’ phase is greater than that of the  phase. The growth kinetics of the intermetallic compounds and the diffusion behavior in the ’ phase have been investigated.

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Defect and Diffusion Forum (Volumes 297-301)

Pages:

796-801

DOI:

https://doi.org/10.4028/www.scientific.net/DDF.297-301.796

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Online since:

April 2010

Authors:

O. Taguchi, C.G. Lee, D.Y. Park, G.S. Shin, Shigeru Suzuki, Ryusuke Nakamura

Keywords:

Diffusion, Growth Rate Constant, Layer Thickness, Pb-Free Solder, Sn-Ag Alloy

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