Effect of Interfaces and Cr Diffusion on Stabilizing Cu Conductivity in Nb3Sn-Strands

E.N. Popova; I.L. Deryagina; M.V. Polikarpova; D.C. Novosilova; A.E. Vorobyova

doi:10.4028/www.scientific.net/DDF.334-335.241

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HomeDefect and Diffusion ForumDefect and Diffusion Forum Vols. 334-335Effect of Interfaces and Cr Diffusion on...

Effect of Interfaces and Cr Diffusion on Stabilizing Cu Conductivity in Nb₃Sn-Strands

Abstract:

The structure of high-purity copper and stabilizing copper of Cr-plated Nb₃Sn-strands with different RRR (residual resistance ratio) values has been studied. Cr diffusion into peripheral layers of stabilizing Cu has been revealed. The variations of RRR and Cr content in Cu at annealing have been estimated. It is demonstrated that an additional drop of RRR may be caused by oxygen diffusion from Cr coating obtained by electroplating. Optimal regimes of the diffusion annealing of Cr-plated Nb₃Sn-strands for ITER (International Thermonuclear Experimental Reactor) have been determined.

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Defect and Diffusion Forum (Volumes 334-335)

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241-246

DOI:

https://doi.org/10.4028/www.scientific.net/DDF.334-335.241

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Online since:

February 2013

Authors:

E.N. Popova, I.L. Deryagina, M.V. Polikarpova, D.C. Novosilova, A.E. Vorobyova

Keywords:

Bronze Technology, Cr-Plating, Diffusion, Diffusion Annealing, Interface, Multifilamentary Superconductors, Parameter RRR, Stabilizing Copper

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