Influence of Oxide Dispersoids on the Structure Development of Copper Nanocomposite Prepared by Spark Plasma Sintering Technology

Abstract:

Dispersion strengthened Cu composites are studied over recent years to find an optimum processing route to obtain a high strength, thermal-stable copper alloy designed for modern applications in electrical engineering. The experimental Cu–4Al₂O₃–1MgO material was prepared by in situ thermo-chemical technique and mechanical milling followed by spark plasma sintering (SPS). The study analyses the influence of the Al₂O₃ and MgO secondary phases on strengthening the copper matrix. Microstructure of the composite was studied by X-ray diffraction analysis, scanning and transmission electron microscopy. The sintered microstructure shows a grain size distribution characterized by ultrafine grains/twins embedded inside the matrix of nanocrystalline grains. The microstructure is thermal stable up to 900 °C due to the dispersed alumina nano-particles that effectively strengthen crystallite/grain boundaries during the SPS process and annealing of the sintered compact at elevated temperatures. On the other hand, the coarsened MgO particles are responsible for ultrafine grains/twins formation. The obtained microstructure is important for practical utilization of the material because this structure is characterized by a good combination of strength and ductility.

• Periodical: Defect and Diffusion Forum (Volume 405)
• Pages: 391-395
• DOI: https://doi.org/10.4028/www.scientific.net/DDF.405.391
• Online since: November 2020
• Authors: Juraj Szabo*, Katarína Ďurišinová, Ondrej Milkovič, Juraj Ďurišin
• Keywords: Dispersion Strengthened Copper, Microstructure, Oxide Dispersoids, Thermal Stability

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