Diffusion Parameters, Grain Boundary Structure and Diffusion Mechanism in the Vicinity of the Σ 5 Coincidence Misorientation in Copper

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Periodical:

Defect and Diffusion Forum (Volumes 66-69)

Edited by:

F.J. Kedves and D.L. Beke

Pages:

861-868

DOI:

10.4028/www.scientific.net/DDF.66-69.861

Citation:

A.N. Aleshin et al., "Diffusion Parameters, Grain Boundary Structure and Diffusion Mechanism in the Vicinity of the Σ 5 Coincidence Misorientation in Copper", Defect and Diffusion Forum, Vols. 66-69, pp. 861-868, 1990

Online since:

January 1991

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$35.00

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