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HomeDefect and Diffusion ForumDefect and Diffusion Forum Vols. 95-98Grain Boundary and Bulk Diffusion in Au-Cu Thin...

Grain Boundary and Bulk Diffusion in Au-Cu Thin Films

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Diffusion in Materials - DIMAT 1992

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Periodical:

Defect and Diffusion Forum (Volumes 95-98)

Pages:

457-462

DOI:

https://doi.org/10.4028/www.scientific.net/DDF.95-98.457

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Online since:

January 1993

Authors:

A.N. Aleshin, Boris S. Bokstein, V.K. Egorov, P.V. Kurkin

Keywords:

Au-Cu Thin Films, Bulk Diffusion, Grain Boundary, Grain Boundary Diffusion

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© 1993 Trans Tech Publications Ltd. All Rights Reserved

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