Grain Boundary and Bulk Diffusion in Au-Cu Thin Films

Abstract:

Article Preview

Info:

Periodical:

Defect and Diffusion Forum (Volumes 95-98)

Edited by:

M. Koiwa, K. Hirano, H. Nakajima and T. Okada

Pages:

457-462

DOI:

10.4028/www.scientific.net/DDF.95-98.457

Citation:

A.N. Aleshin et al., "Grain Boundary and Bulk Diffusion in Au-Cu Thin Films", Defect and Diffusion Forum, Vols. 95-98, pp. 457-462, 1993

Online since:

January 1993

Export:

Price:

$35.00

In order to see related information, you need to Login.