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Grain Boundary and Bulk Diffusion in Au-Cu Thin Films
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Diffusion Mechanisms and Physical Properties of the Local Regions of the Grain Boundary Diffusion Zone in Nanometer-Sized-Polycrystalline Palladium
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HomeDefect and Diffusion ForumDefect and Diffusion Forum Vols. 95-98Pressure Effect on Grain Boundary Kinetics and...

Pressure Effect on Grain Boundary Kinetics and Phase Transitions

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Diffusion in Materials - DIMAT 1992

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Periodical:

Defect and Diffusion Forum (Volumes 95-98)

Pages:

449-456

DOI:

https://doi.org/10.4028/www.scientific.net/DDF.95-98.449

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Online since:

January 1993

Authors:

Witold Łojkowski, J. Swiderski, Yoritoshi Minamino, Toshimi Yamane, J. Kwiecinski, D.A. Molodow, Eugen Rabkin, Lasar S. Shvindlerman, Boris B. Straumal

Keywords:

Activation Volume, Grain Boundary Diffusion, Grain Boundary Energy, Grain Boundary Migration, Wetting

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© 1993 Trans Tech Publications Ltd. All Rights Reserved

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