Strengthening of Nanostructured Aluminium-Copper Thin Films

M. Draissia; M.Y. Debili

doi:10.4028/www.scientific.net/JMNM.22.121

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Strengthening of Nanostructured Aluminium-Copper Thin Films
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Strengthening of Nanostructured Aluminium-Copper Thin Films

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Journal of Metastable and Nanocrystalline Materials (Volume 22)

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121-0

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https://doi.org/10.4028/www.scientific.net/JMNM.22.121

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Online since:

August 2004

Authors:

M. Draissia, M.Y. Debili

Keywords:

Aluminium Alloy, Hardness, Intermetallic Compound (IMC), Sputtering, Structure

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References

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