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HomeJournal of Metastable and Nanocrystalline...Journal of Metastable and Nanocrystalline...Lead-Free Solder System Bi5-Ag3-Cu0.5-Sn Prepared...

Lead-Free Solder System Bi5-Ag3-Cu0.5-Sn Prepared by Mechanical Alloying

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ISMANAM-2004

Info:

Periodical:

Journal of Metastable and Nanocrystalline Materials (Volumes 24-25)

Pages:

451-454

DOI:

https://doi.org/10.4028/www.scientific.net/JMNM.24-25.451

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Online since:

September 2005

Authors:

Caleb Carreño-Gallardo, Ivanovich Estrada-Guel, Miguel Neri-Flores, Roberto Martínez-Sánchez

Keywords:

Ag₃Sn Intermetallic Compound, Lead-Free Solder, Mechanical Alloying (MA)

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© 2005 Trans Tech Publications Ltd. All Rights Reserved

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