Lead-Free Solder System Bi5-Ag3-Cu0.5-Sn Prepared by Mechanical Alloying

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Edited by:

Akihisa Inoue

Pages:

451-454

DOI:

10.4028/www.scientific.net/JMNM.24-25.451

Citation:

C. Carreño-Gallardo et al., "Lead-Free Solder System Bi5-Ag3-Cu0.5-Sn Prepared by Mechanical Alloying", Journal of Metastable and Nanocrystalline Materials, Vols. 24-25, pp. 451-454, 2005

Online since:

September 2005

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