Effect of SiC Nanoparticles Dispersion on the Microstructure and Mechanical Properties of Electroplated Sn-Bi Solder Alloy

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The effect of SiC nanoparticle dispersion was investigated for microstructure change and mechanical properties of Sn-Bi electroplated alloys. The diameters of SiC nanoparticle in this study were 45-55 nm. The SiC nanoparticles were mixed with Sn-Bi electroplating and then the nanoparticles were dispersed with ultrasonic vibrator. After the dispersion, the SiC dispersed Sn-Bi alloys were electroplated on Cu deposited Si wafer. The microstructure and mechanical properties of the sample were evaluated by FE-TEM, FE-SEM, EDS, and shear tester. For TEM observation, the specimens were prepared by ultramicrotome and FIB. The SiC nanoparticles were well-dispersed in Sn-Bi alloy. SiC particles were located near grain boundaries or grain inside. The average grain size of the solder alloy was decrease about 30% compared with the grain size of Sn-Bi alloy prepared in the same condition. Due to the grain refinement and dispersion hardening by SiC nanoparticles, the SiC dispersed Sn-Bi alloy is expected to obtain high reliability and joining strength when it applied to interconnection materials.

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Periodical:

Edited by:

Andreas Öchsner, Irina V. Belova and Graeme E. Murch

Pages:

113-118

DOI:

10.4028/www.scientific.net/JNanoR.11.113

Citation:

C. W. Lee et al., "Effect of SiC Nanoparticles Dispersion on the Microstructure and Mechanical Properties of Electroplated Sn-Bi Solder Alloy", Journal of Nano Research, Vol. 11, pp. 113-118, 2010

Online since:

May 2010

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$35.00

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