Effect of SiC Nanoparticles Dispersion on the Microstructure and Mechanical Properties of Electroplated Sn-Bi Solder Alloy
The effect of SiC nanoparticle dispersion was investigated for microstructure change and mechanical properties of Sn-Bi electroplated alloys. The diameters of SiC nanoparticle in this study were 45-55 nm. The SiC nanoparticles were mixed with Sn-Bi electroplating and then the nanoparticles were dispersed with ultrasonic vibrator. After the dispersion, the SiC dispersed Sn-Bi alloys were electroplated on Cu deposited Si wafer. The microstructure and mechanical properties of the sample were evaluated by FE-TEM, FE-SEM, EDS, and shear tester. For TEM observation, the specimens were prepared by ultramicrotome and FIB. The SiC nanoparticles were well-dispersed in Sn-Bi alloy. SiC particles were located near grain boundaries or grain inside. The average grain size of the solder alloy was decrease about 30% compared with the grain size of Sn-Bi alloy prepared in the same condition. Due to the grain refinement and dispersion hardening by SiC nanoparticles, the SiC dispersed Sn-Bi alloy is expected to obtain high reliability and joining strength when it applied to interconnection materials.
Andreas Öchsner, Irina V. Belova and Graeme E. Murch
C. W. Lee et al., "Effect of SiC Nanoparticles Dispersion on the Microstructure and Mechanical Properties of Electroplated Sn-Bi Solder Alloy", Journal of Nano Research, Vol. 11, pp. 113-118, 2010