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HomeKey Engineering MaterialsKey Engineering Materials Vols. 132-136Mesoscopic Modeling of the Intergranular Structure...

Mesoscopic Modeling of the Intergranular Structure of Y₂O₃ Doped Aluminium Nitride and Application to the Prediction of the Effective Thermal Conductivity

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Euro Ceramics V

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Periodical:

Key Engineering Materials (Volumes 132-136)

Pages:

623-626

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.132-136.623

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Online since:

April 1997

Authors:

C. Pélissonnier-Grosjean, D. Jeulin, L. Pottier, D. Fournier, A. Thorel

Keywords:

Aluminum Nitride (AlN), Intergranular Structure, Random Set Modeling, Thermal Conductivity (TC)

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© 1997 Trans Tech Publications Ltd. All Rights Reserved

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