Paper Titles

'Photothermal Characterisation of Microelectronics Ceramics at Various Scales'
p.663

High Temperature Tensile Testing Apparatus for Industrial Ceramics Characterization
p.667

Shape Prediction Procedure for Die Pressed Ceramic compacts
p.670

Structure Development During Linear Heating and Rate-Controlled Sintering of Ceramics: Statistical Model and Experiment
p.674

Modelling of Binder Burnout Process for Ceramic Compacts
p.678

Modelling of Thermal Shock Behaviour
p.682

Finite Element Modeling of Binder Removal from Ceramic Moldings
p.686

Numerical Simulation of Alumina Fracture
p.690

Rheological Analysis of Stress-Strain Hysteresis in Silicon Nitride at High Temperature
p.694

HomeKey Engineering MaterialsKey Engineering Materials Vols. 132-136Modelling of Binder Burnout Process for Ceramic...

Modelling of Binder Burnout Process for Ceramic Compacts

Article Preview

Abstract:

You might also be interested in these eBooks

Euro Ceramics V

Info:

Periodical:

Key Engineering Materials (Volumes 132-136)

Pages:

678-681

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.132-136.678

Citation:

Cite this paper

Online since:

April 1997

Authors:

Brian J. Briscoe, T. Savvas, N. Özkan

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

© 1997 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation: