The Relationship between Thermal Conductivity and Microstructure in Si3N4 Ceramics

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Periodical:

Key Engineering Materials (Volumes 161-163)

Edited by:

K. Niihara, T. Sekino, E. Yasuda, T. Sasa

Pages:

213-216

DOI:

10.4028/www.scientific.net/KEM.161-163.213

Citation:

K. Watari et al., "The Relationship between Thermal Conductivity and Microstructure in Si3N4 Ceramics", Key Engineering Materials, Vols. 161-163, pp. 213-216, 1999

Online since:

July 1998

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Price:

$35.00

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