Paper Titles

The Relationship between Thermal Conductivity and Microstructure in Si₃N₄ Ceramics
p.213

Thermodynamic and Microstructural Studies of Coloration and Decoloration Processes during Gas-Pressure Sintering of Silicon Nitride Ceramics
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The Effect of Sintering Atmosphere on the Phase Composition and Strength of Silicon Nitride
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Relationship between Microstructure and Mechanical Properties for Silicon Nitride Based Ceramics Fabriacted by PECS
p.225

Sub-Grain Boundary Formation in Si₃N₄ Based Ceramics
p.229

Corrosion Resistance of Silicon Nitride Ceramics
p.235

Characteristic of (Dy+Sm)-Sialon Ceramics
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Fabriaction and Mechanical Properties of Fine-Grained Silicon Carbide Ceramics
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Microstructure of Silicon Carbide with Yttrium-Aluminum Garnet and Silica
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HomeKey Engineering MaterialsKey Engineering Materials Vols. 161-163Sub-Grain Boundary Formation in Si3N4 Based...

Sub-Grain Boundary Formation in Si₃N₄ Based Ceramics

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The Science of Engineering Ceramics II

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Periodical:

Key Engineering Materials (Volumes 161-163)

Pages:

229-234

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.161-163.229

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Online since:

July 1998

Authors:

Pavol Šajgalík, K. Rajan, Ralf Riedel

Keywords:

Bend Strength, Fracture Toughness, Residual Stress, Subgrain Boundary, Weibull Modulus

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© 1999 Trans Tech Publications Ltd. All Rights Reserved

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