Microstructural Degradation Accompanying Tensile Creep Deformation in Quasi-Ductile Silicon Nitride

Abstract:

Article Preview

Info:

Periodical:

Key Engineering Materials (Volumes 175-176)

Edited by:

P. Sajgalík and Z. Lencés

Pages:

321-334

DOI:

10.4028/www.scientific.net/KEM.175-176.321

Citation:

F. Lofaj et al., "Microstructural Degradation Accompanying Tensile Creep Deformation in Quasi-Ductile Silicon Nitride", Key Engineering Materials, Vols. 175-176, pp. 321-334, 2000

Online since:

October 1999

Export:

Price:

$35.00

In order to see related information, you need to Login.