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HomeKey Engineering MaterialsKey Engineering Materials Vols. 175-176Microstructural Degradation Accompanying Tensile...

Microstructural Degradation Accompanying Tensile Creep Deformation in Quasi-Ductile Silicon Nitride

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Periodical:

Key Engineering Materials (Volumes 175-176)

Pages:

321-334

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.175-176.321

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Online since:

October 1999

Authors:

František Lofaj, Atsushi Okada, Yasushi Ikeda, Y. Mizuta, Hatsuhiko Usami, Hiroshi Kawamoto

Keywords:

Cavitation, Oxidation, Tensile Creep, Young's Modulus Degradation

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© 2000 Trans Tech Publications Ltd. All Rights Reserved

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