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HomeKey Engineering MaterialsKey Engineering Materials Vols. 183-187A Thermomechanical Analysis of MCM-D Substrate of...

A Thermomechanical Analysis of MCM-D Substrate of Polymer and Metal Multilayer

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Periodical:

Key Engineering Materials (Volumes 183-187)

Pages:

1123-1128

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.183-187.1123

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Online since:

April 2000

Authors:

Ji Ho Lim, Ji Soon Kim, Kyoung Wook Paik, Y.Y. Earmme

Keywords:

CBA, Lamination, Laser Profilometry, MCM-D, Multilayer, Stoney's Formula, Stress Relaxation, Thermomechanical Bow

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© 2000 Trans Tech Publications Ltd. All Rights Reserved

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