A Thermomechanical Analysis of MCM-D Substrate of Polymer and Metal Multilayer

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Periodical:

Key Engineering Materials (Volumes 183-187)

Edited by:

W. Hwang and K.S. Han

Pages:

1123-1128

DOI:

10.4028/www.scientific.net/KEM.183-187.1123

Citation:

J. H. Lim et al., "A Thermomechanical Analysis of MCM-D Substrate of Polymer and Metal Multilayer", Key Engineering Materials, Vols. 183-187, pp. 1123-1128, 2000

Online since:

April 2000

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$35.00

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