Paper Titles

Chemical Mechanical Polishing (CMP) in Magnetic Float Polishing (MFP) of Advanced Ceramic (Silicon Nitride) and Glass (Silicon Dioxide)
p.1

Fuzzy Contact and Its Effect on Thermal Damage in Grinding Processes
p.15

Bifractal Characteristics of Ground Workpiece Surfaces
p.25

Wear Pattern of Coated Carbide Tools in High Speed Threading of a Ni-Cr-Mo Base Steel
p.29

A Study on Surface Quality of Ultraprecision Grinding for Engineering Ceramics
p.35

A Complex Thermal Model for Deep Grinding
p.41

A Study of Turning Operation by Oil-Water Combined Mist Lubrication Machining Method
p.47

Research on Enhancing Heat Transfer in Grinding Contact Zone with Radial Water Jet Impinging Cooling
p.53

Significance of Grinding Temperature in Metal Removal
p.57

HomeKey Engineering MaterialsKey Engineering Materials Vols. 202-203A Study on Surface Quality of Ultraprecision...

A Study on Surface Quality of Ultraprecision Grinding for Engineering Ceramics

Article Preview

Abstract:

You might also be interested in these eBooks

Advances in Abrasive Processes

Info:

Periodical:

Key Engineering Materials (Volumes 202-203)

Pages:

35-40

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.202-203.35

Citation:

Cite this paper

Online since:

June 2001

Authors:

S.Y. Yu, X.S. Han, Bin Lin

Keywords:

Ceramic, Engineering, Feature, Grinding, Micro-Scale, Quality, Surface, TEM, Ultra-Precision, X-Ray Diffraction (XRD)

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

© 2001 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation: