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HomeKey Engineering MaterialsKey Engineering Materials Vols. 224-226The Thermal Transient Stress Maximum during...

The Thermal Transient Stress Maximum during Quenching of Ceramics: A Comparison of Experimental Data with Numerical Simulation

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High-Performance Ceramics 2001

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Periodical:

Key Engineering Materials (Volumes 224-226)

Pages:

807-812

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.224-226.807

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Online since:

June 2002

Authors:

Frédéric Osterstock, Franck Tancret, Jean-Marie Gatt

Keywords:

Biot Number, Heat Transfer, Indentation, Quenching, Simulation, Thermal Stress

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© 2002 Trans Tech Publications Ltd. All Rights Reserved

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