The Thermal Transient Stress Maximum during Quenching of Ceramics: A Comparison of Experimental Data with Numerical Simulation

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Periodical:

Key Engineering Materials (Volumes 224-226)

Edited by:

Jianghong Gong and Wei Pan

Pages:

807-812

DOI:

10.4028/www.scientific.net/KEM.224-226.807

Citation:

F. Osterstock et al., "The Thermal Transient Stress Maximum during Quenching of Ceramics: A Comparison of Experimental Data with Numerical Simulation", Key Engineering Materials, Vols. 224-226, pp. 807-812, 2002

Online since:

June 2002

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$35.00

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