Influence of Soft Interlayer on Crack Growth Behavior in Bimetal Plate

Article Preview

Abstract:

You might also be interested in these eBooks

Info:

Periodical:

Key Engineering Materials (Volumes 243-244)

Pages:

315-320

Citation:

Online since:

July 2003

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2003 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

[1] T.S. Cook and F. Erdogan: Stresses in bonded materials with a crack perpendicular to the interface. Int. J. Engineering Science Vol.10 (1972), p.677

DOI: 10.1016/0020-7225(72)90063-8

Google Scholar

[2] F. Erdogan and V. Biricikoglu: Two bonded half-planes with a crack going through the interface. Int. J. Engineering Science Vol.11 (1973), p.745

DOI: 10.1016/0020-7225(73)90004-9

Google Scholar

[3] M.C. He and J.W. Hutchinson: Crack deflection at an interface between dissimilar elastic materials. Int. J. Solids and Structures Vol.25 (1989), p.1053 �

DOI: 10.1016/0020-7683(89)90021-8

Google Scholar

[4] Y. Sugimura, P.G. Lim, C.F. Shih and S. Suresh: Fracture normal to a bimaterial interface. Acta. Metall. Mater. Vol.43 (1995), p.1157

DOI: 10.1016/0956-7151(94)00295-s

Google Scholar

[5] A.S. Kim and S. Suresh: Plasticity effects on fracture normal to interfaces with homogeneous and graded compositions. Int. J. Solids Structures Vol.34 (1997), p.3415

DOI: 10.1016/s0020-7683(96)00225-9

Google Scholar

[6] F.O. Riemelmoser and R. Pippan: The J-integral at Dugdale cracks perpendicular to interfaces of materials with dissimilar yield stresses. Int. J. Fracture Vol.103 (2000), p.397 ������ � �

Google Scholar