Paper Titles

Grain Boundary Characters and Structures in Oxide Ceramics
p.335

Model Studies of Surfaces and Interfaces in Ceramics
p.341

Improvement in High-Temperature Properties of Al₂O₃ Ceramics by Microstructure and Grain Boundary Control
p.349

Study of the Thermal Conductivity of Si₃N₄ Sintered with CeO₂ and MgO Additives
p.355

Microstructure and Thermal Conductivity of AlN Ceramic with Eliminated Grain Boundary Phase
p.361

Study of Electrical Fatigue of Ferroelectric Ceramics
p.365

Development of Textured Bismuth Titanate Piezoelectric Ceramics
p.371

Grain-Boundary Structural Transition and Sintering Behavior in Barium Titanate
p.377

Variation of Electrical Properties of Sr_0.8Bi_2+XTa₂O_9+δ Ferroelectric Thin Films with Bismuth Content
p.381

HomeKey Engineering MaterialsKey Engineering Materials Vol. 247Microstructure and Thermal Conductivity of AlN...

Microstructure and Thermal Conductivity of AlN Ceramic with Eliminated Grain Boundary Phase

Article Preview

Abstract:

You might also be interested in these eBooks

Advanced Ceramics and Composites

Info:

Periodical:

Key Engineering Materials (Volume 247)

Pages:

361-364

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.247.361

Citation:

Cite this paper

Online since:

August 2003

Authors:

Koji Watari, Hiromi Nakano, Takahisa Tsugoshi, Takaaki Nagaoka, Kazuyori Urabe, S. Cao, Katsunori Mori, Kozo Ishizaki

Keywords:

Aluminum Nitride (AlN), Temperature Dependence, Thermal Conductivity (TC)

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

© 2003 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation: