Study on Mechanism for Material Removal and Surface Generation by Molecular Dynamics Simulation in Abrasive Processes

Bin Lin; Hui Wu; Hong Tao Zhu; S.Y. Yu

doi:10.4028/www.scientific.net/KEM.259-260.211

Paper Titles

Study on the Wear Capability of Several Kinds of New-Style Glue Rolls
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Study on Sphere Shaping Mechanism of Ceramic Ball for Lapping Process
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Discontinuous Grinding of Polycrystalline Diamond with Slotted Diamond Wheels
p.201

A New Method for Suppressing the Grinding Chatter - Limited Random Feed Method
p.206

Study on Mechanism for Material Removal and Surface Generation by Molecular Dynamics Simulation in Abrasive Processes
p.211

Towards a Deep Understanding of Molecular Dynamics Simulation in Nanometric Machining
p.216

Study on Service Performance Evaluation of Grinding Coolants
p.221

Quantitative Study of Coated Diamond Sawing
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Surface Quality Studies with Respect to Grinding Burn of New Typical Nickel-Based Superalloy
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Study on Mechanism for Material Removal and Surface Generation by Molecular Dynamics Simulation in Abrasive Processes

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Periodical:

Key Engineering Materials (Volumes 259-260)

Pages:

211-215

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.259-260.211

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Online since:

March 2004

Authors:

Bin Lin, Hui Wu, Hong Tao Zhu, S.Y. Yu

Keywords:

Indentation, Mechanism of Material Removal and Surface Generation, Molecular Dynamic (MD), Nanometer Grinding, Simulation Experiment

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