Transient Anti-Plane Crack Problem in a Functionally Graded Smart Structure

Abstract:

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The dynamic anti-plane crack problem in a functionally graded smart structure is considered. Integral transforms are employed to reduce the problem to the solution of singular integral equations. Numerical results are presented to show the nfluences of electrical crack condition, crack position, electromechanical combination factor and material gradient parameter on the fracture behavior.

Info:

Periodical:

Key Engineering Materials (Volumes 261-263)

Edited by:

Kikuo Kishimoto, Masanori Kikuchi, Tetsuo Shoji and Masumi Saka

Pages:

257-262

DOI:

10.4028/www.scientific.net/KEM.261-263.257

Citation:

Z.Z. Zou et al., "Transient Anti-Plane Crack Problem in a Functionally Graded Smart Structure", Key Engineering Materials, Vols. 261-263, pp. 257-262, 2004

Online since:

April 2004

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Price:

$35.00

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