Transient Anti-Plane Crack Problem in a Functionally Graded Smart Structure

Z.Z. Zou; J. Chen; Sheng Xing Wu

doi:10.4028/www.scientific.net/KEM.261-263.257

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HomeKey Engineering MaterialsKey Engineering Materials Vols. 261-263Transient Anti-Plane Crack Problem in a...

Transient Anti-Plane Crack Problem in a Functionally Graded Smart Structure

Abstract:

The dynamic anti-plane crack problem in a functionally graded smart structure is considered. Integral transforms are employed to reduce the problem to the solution of singular integral equations. Numerical results are presented to show the nfluences of electrical crack condition, crack position, electromechanical combination factor and material gradient parameter on the fracture behavior.

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Periodical:

Key Engineering Materials (Volumes 261-263)

Pages:

257-262

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.261-263.257

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Online since:

April 2004

Authors:

Z.Z. Zou, J. Chen, Sheng Xing Wu

Keywords:

Electric Displacement Intensity Factor (EDIF), Functionally Graded Material (FGM), Piezoelectricity, Stress Intensity Factor (SIF)

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