Microstructural Control of Y2O3 Coating on Quartz Glass for the Reduced Thermal Mismatch Stress

Doh Hyung Riu; Seok Woo Lee; Young Keun Jeong; Sung Churl Choi

doi:10.4028/www.scientific.net/KEM.264-268.601

Paper Titles

Wear and Friction Properties of Multilayer Hard Coatings by HTCVD Method
p.585

Wear Behaviour of Plasma Sprayed WC-Ni Coatings
p.589

Processing and Characterization of Functionally Graded Ti/Ti_xC_y/DLC Thin Film Coatings
p.593

The Structural and Optical Properties of Tungsten Oxide Films and Doped Tungsten Oxide Films with Transition Metal Oxide
p.597

Microstructural Control of Y₂O₃ Coating on Quartz Glass for the Reduced Thermal Mismatch Stress
p.601

Ti(C,N) Hard Coatings Prepared by Pulsed High Energy Density Plasma
p.605

Characterization of Superhard Ternary (Ti,Al)N Coatings Prepared by Pulsed High Energy Density Plasma
p.609

YBCO Thick Film by Acetate and Nitrate Based Sol-Gel Precursor
p.613

Thick YBCO and Y_0.5RE_0.5BCO Coated Conductor by Sol-Gel Dip Coating Process
p.617

HomeKey Engineering MaterialsKey Engineering Materials Vols. 264-268Microstructural Control of Y2O3 Coating on Quartz...

Microstructural Control of Y₂O₃ Coating on Quartz Glass for the Reduced Thermal Mismatch Stress

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Key Engineering Materials (Volumes 264-268)

Pages:

601-604

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.264-268.601

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Online since:

May 2004

Authors:

Doh Hyung Riu, Seok Woo Lee, Young Keun Jeong, Sung Churl Choi

Keywords:

Coating, Crack, Microstructure, Residual Stress, Self-Buffer Layer, Y₂O₃

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References

[1] H. Yamada, T. Ohashi: US Patent application 20030059653 (2003).

Google Scholar

[2] L. Lou, W. Zhang, A. Brioude, C. Le Luyer and J. Muignier: Opt. Mat. Vol. 18 (2001) p.331.

Google Scholar

[3] G. Towee and D. R. Uhlmann: J. Sol-Gel Sci & Tech., Vol. 13 (1998), p.895.

Google Scholar

[4] T. Nishide and M. Shibata:J. Sol-Gel Sci. &Tech., Vol. 21 (2001) p.189.

Google Scholar

[5] J. Kawashima, Y. Yamada, and I. Hirabayashi: Physica C Vol. 306 (1998) p.114.

Google Scholar

[6] A. Matoussi, T. Boufaden, A. Missaoui, S. Guermazi, B. Bessais, Y. Mlik and B. El Jani: Microelelectronics J. Vol. 32 (2001), p.995.

DOI: 10.1016/s0026-2692(01)00061-1

Google Scholar

[7] M Mynbaeva, et. al. : Appl. Phy. Lett., Vol. 76 (2000) p.1113.

Google Scholar

[8] O. Yeheskel and Ofer Tevet: J. Am. Ceram. Soc., Vol. 82 (1999), p.136.

Google Scholar

[9] D. C. Harris et. al. : J. Am. Ceram. Soc., Vol. 75 (1992).

Google Scholar