The Effect of Metal Coating on the Strength of Capacitor-Discharge Joining of Oxide Ceramics

Servet Turan; Dilek Turan; I.A. Bucklow; E.R. Wallach

doi:10.4028/www.scientific.net/KEM.264-268.687

Paper Titles

Ceramic Backing Materials Used in One-Side Welding Methods
p.671

Realisation of Joining between Copper and Aluminium Nitride
p.675

Contact Angle – Surface Energy Dependence in Solid Oxide / Liquid Metal Systems
p.679

The Characterization of Metal-Ceramic Interfaces in Porcelain Teeth
p.683

The Effect of Metal Coating on the Strength of Capacitor-Discharge Joining of Oxide Ceramics
p.687

Measured Anisotropy of Alumina Components Produced by Direct Ink-Jet Printing
p.693

Ink-Jet Printing of Wax-Based PZT Suspensions
p.697

Manufacturing of Complex Ceramic Parts by Selective Curing of Pastes
p.701

Reaction-Based Processing Methods
p.707

HomeKey Engineering MaterialsKey Engineering Materials Vols. 264-268The Effect of Metal Coating on the Strength of...

The Effect of Metal Coating on the Strength of Capacitor-Discharge Joining of Oxide Ceramics

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Periodical:

Key Engineering Materials (Volumes 264-268)

Pages:

687-692

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.264-268.687

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Online since:

May 2004

Authors:

Servet Turan, Dilek Turan, I.A. Bucklow, E.R. Wallach

Keywords:

Bonding, Joining, Reaction, Sputter Coating, TEM

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References

[1] K.A. Yushchenko, V.S. Nesmikh and I.V. Dubovetskii, In Advances in Joining Newer Structural Materials, p.109 (1990).

Google Scholar

[2] S. Turan, I.A. Bucklow and E.R. Wallach, J. Am. Ceram. Soc., 82, 1242 (1999).

Google Scholar

[3] S. Turan, Materials Science Forum, 294-296, 345 (1999).

Google Scholar

[4] S. Turan, D. Özkaya, I.A. Bucklow and E.R. Wallach, Inst. Phys. Conf. Ser., 161, 79 (1999).

Google Scholar

[5] S. Turan, D. Turan, I.A. Bucklow and E.R. Wallach, Inst. Phys. Conf. Ser., 168, 319 (2001).

Google Scholar

[6] S. Turan, I.A. Bucklow, E.R. Wallach and D. Turan, Key Eng. Mater., 206-213, 491 (2002).

DOI: 10.4028/www.scientific.net/kem.206-213.491

Google Scholar

[7] K. Takaki, Y. Fujimaki, Y. Takada, M. Itagaki, T. Fujiwara, S. Ohshima, K. Oyama, I. Takahashi ve T. Kuwashima, Vacuum, 65, 457 (2002).

DOI: 10.1016/s0042-207x(01)00456-0

Google Scholar

[8] M.L. Santella and J.J. Pak, Welding Research Supplement, p.165 (1993).

Google Scholar

[9] X.L. Li, R. Hillel, F. Teyssandier, S.K. Choi, and F.J.V.V. Loo, Acta Metall. Mater., 40, 3149 (1992).

Google Scholar

[10] A.K. Misra, Met. Tran. A., 22A, 715 (1991).

Google Scholar

[11] J.H. Selverian, F.S. Ohuchi, M. Bortz, and M.R. Notis, J. Mat. Sci., 26, 6300 (1991).

Google Scholar

[12] K. Takahashi, H. Ishii, Y. Takahashi, and K. Nishiguchi, Thin Solid Films, 216, 98 (1992).

Google Scholar

[13] T.B. Massalski, Binary Alloy Phase Diagrams, Vol; 2, Am. Soc. Metals, Metals Park, Ohio, (1986).

Google Scholar

[14] K-F Lin and C-C. Lin, J. Am. Ceram. Soc., 82, 3179 (1999).

Google Scholar