Realisation of Joining between Copper and Aluminium Nitride

Abstract:

• Periodical: Key Engineering Materials (Volumes 264-268)
• Pages: 675-678
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.264-268.675
• Online since: May 2004
• Authors: Jean Jarrige, Thierry Joyeux, J.C. Labbe, J.P. Lecompte
• Keywords: Aluminum Nitride (AlN), Copper (Cu), Copper Oxide, Direct Copper Bonding, Joining, Thermal Conductivity (TC), Wettability

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