Realisation of Joining between Copper and Aluminium Nitride

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Key Engineering Materials (Volumes 264-268)

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Edited by:

Hasan Mandal and Lütfi Öveçoglu

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675-678

DOI:

10.4028/www.scientific.net/KEM.264-268.675

Citation:

J. Jarrige et al., "Realisation of Joining between Copper and Aluminium Nitride", Key Engineering Materials, Vols. 264-268, pp. 675-678, 2004

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May 2004

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[1] Burgess J.F. Neugebauer C.A. , J. Electrochem. Soc., vol. 122, 1975, pp.688-690.

[2] Yoshino Y. , J. Am. Ceram. Soc., vol 72, 1989, pp.1322-1327.

[3] Jarrige J., Mexmain J., Michelet J.P., Guinet J., Guillaume B., Hubert J.C. , Proceedings of the 6th International Microelectronics Conference (ISHM), Tokyo. Japon. 30 Mai-1 Juin, 1990, p.273.

[4] Guinet J., Michelet JP., Jarrige J., Mexmain J., ISHM proceedings 8th European Hybrid Microelectronics Conference, Rotterdam (Netherlands), 1991, pp.503-513.

[5] Weiss P. K,. Gobrecht J, Mat. Res. Soc. Symp. Proc., vol. 40, 1985, pp.399-404.

[6] Grant M., J. Adh. Sci. Techn., vol. 6, 1992, pp.635-651.

[7] Jarrige J., Michelet J.P., Mexmain J., Silicates Industriels, vol 9-10, 1993, pp.199-208.

[8] Joyeux T., Jarrige J., Labbe J.C., Lecomùpte J.P., Alexandre T., proceedings of the 7th conference and exhibition of the ECERS, Bruges (Belgique), 2001, vol 206-213, 2001, pp.535-538.

[9] Leroux V, Labbe J. C, Shanahan M.E. R, Tétard D, Goujaud J. F, J. High Temp Chem. Proc., 4, 3, 2000, pp.351-364.

[10] Joyeux T., El Ganaoui M., Lecompte J. P., Jarrige J. , Sciences et technologies thermiques face au XXI e siècle. Eds C. Castelain et D. Delaunay. Elsevier. , 2001, pp.621-626.

[11] Joyeux T., El Ganaoui M., Jarrige J., Labbe J. C., Lecompte J. P. , Actes du colloque sur les innovations dans les matériaux frittés. Poitiers, 2001, p. IV. 11. 1-6. 0 0. 2 0. 4 0. 6 0. 8 1 0 0. 04 0. 08 0. 12 0. 16 0. 2 time (s) T/Tmax Calculed thermogram with TCR Experimental thermogram.

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