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HomeKey Engineering MaterialsKey Engineering Materials Vols. 264-268Profiled Metal-Ceramic Micropackages for Power...

Profiled Metal-Ceramic Micropackages for Power Microwave Diodes

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Euro Ceramics VIII

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Periodical:

Key Engineering Materials (Volumes 264-268)

Pages:

663-666

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.264-268.663

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Online since:

May 2004

Authors:

Jean Jarrige, Cornel Anton, Marcela Muntean

Keywords:

Diffusion Mechanism, Metal-Ceramic, Profiled Micropackage

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© 2004 Trans Tech Publications Ltd. All Rights Reserved

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[1] J.E. Sergent, C.A. Harper: Hybrid Microelctronics Handbook, McGraw Hill, (1995).

[2] R.E. Loehman: Recent Progress in Ceramic Joining (Trans Tech Publication, Switzerland 1999).

[3] C. Anton, M. Muntean, A. Muller, V Burghelea, D. Radu and S. Iordanescu,: Profiled Ceramic Micropackages for Microwave Application (Trans Tech Publication, Switzerland 1999).

DOI: 10.4028/www.scientific.net/kem.161-163.687