Profiled Metal-Ceramic Micropackages for Power Microwave Diodes

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Periodical:

Key Engineering Materials (Volumes 264-268)

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Edited by:

Hasan Mandal and Lütfi Öveçoglu

Pages:

663-666

Citation:

J. Jarrige et al., "Profiled Metal-Ceramic Micropackages for Power Microwave Diodes", Key Engineering Materials, Vols. 264-268, pp. 663-666, 2004

Online since:

May 2004

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$38.00

[1] J.E. Sergent, C.A. Harper: Hybrid Microelctronics Handbook, McGraw Hill, (1995).

[2] R.E. Loehman: Recent Progress in Ceramic Joining (Trans Tech Publication, Switzerland 1999).

[3] C. Anton, M. Muntean, A. Muller, V Burghelea, D. Radu and S. Iordanescu,: Profiled Ceramic Micropackages for Microwave Application (Trans Tech Publication, Switzerland 1999).

DOI: https://doi.org/10.4028/www.scientific.net/kem.161-163.687

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