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HomeKey Engineering MaterialsKey Engineering Materials Vols. 270-273Structural Vibration Analysis of Electronic...

Structural Vibration Analysis of Electronic Equipment for Satellite under Launch Environment

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Periodical:

Key Engineering Materials (Volumes 270-273)

Pages:

1440-1445

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.270-273.1440

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Online since:

August 2004

Authors:

Il Ho Jung, Tae Won Park, Jong Hwi Seo, Sang Won Han, Sung Hun Kim

Keywords:

Electronic Equipment, Finite Element Analysis (FEA), Printed Circuit Board (PCB), Remote Drive Unit (RDU), Satellite, Vibration Analysis (VA)

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© 2004 Trans Tech Publications Ltd. All Rights Reserved

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Citation:

[1] L. Meirovitch: Elements of vibration analysis (McGRAW - HILL, USA 1986).

[2] D. S. Steinberg: Vibration analysis for electronic equipment (Jonh Wiley & Sons, USA 2000).

[3] L. Meirovitch: Analytical Methods in vibrations (The Macmillan Company, UAS 1967).

[4] K. J Kim: Estimation of operational strain from vibration measurement, Journal of sound and vibration(1998), 210(5), pp.567-579.