Detection of Micro-Delamination in Electronic Packaging by Using the Ultrasonic Nonlinearity

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Periodical:

Key Engineering Materials (Volumes 270-273)

Edited by:

Seung-Seok Lee, Dong-Jin Yoon, Joon-Hyun Lee and Sekyung Lee

Pages:

1761-1766

DOI:

10.4028/www.scientific.net/KEM.270-273.1761

Citation:

K. Y. Jhang et al., "Detection of Micro-Delamination in Electronic Packaging by Using the Ultrasonic Nonlinearity", Key Engineering Materials, Vols. 270-273, pp. 1761-1766, 2004

Online since:

August 2004

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$38.00

[1] J.H. Lau, C.P. Wong, J.L. Prince and W. Nakayama: Electronic Packaging: Design, Materials, Process, and Reliability (McGraw-Hill, USA 1998).

[2] T.M. Moore and R.G. Mckenna: Characterization of Integrated Circuit Packaging Materials (Butterworth-Heinemann, USA 1993).

[3] K.Y. Jhang, H.S. Jang, B.I. Park, J. Ha, I.K. Park and K.S. Kim: NDT&E International, Vol. 35(2002), pp.549-557.

[4] K.C. Kim and K.Y. Jhang: JSME International series C, Vol. 44(2001), pp.20-24.

[5] H.J. Jeong, S.H. Nahm, Y.H. Nam and K.Y. Jhang: Ultrasonics, Vol. 41(2003), pp.543-549.

[6] J. Chao, L. Udpa and S.S. Udpa: Review of progress in quantitative nondestructive evaluation, Vol. 12(1993), pp.735-741.

DOI: 10.1007/978-1-4615-2848-7_93

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