Detection of Micro-Delamination in Electronic Packaging by Using the Ultrasonic Nonlinearity

Kyung Young Jhang; Job Ha; Hyo Seong Jang

doi:10.4028/www.scientific.net/KEM.270-273.1761

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Analysis of Singular Thermal Stresses in Polymeric Layer Deposited on Concrete Substrate
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Statistical Reliability Assessment of UT Round-Robin Test Data for Piping Welds
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Reliability Analysis of the Reactor Protection System with Fault Diagnosis
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Comments on Probabilistic Fracture Mechanics Analysis of Cracked Components
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Detection of Micro-Delamination in Electronic Packaging by Using the Ultrasonic Nonlinearity
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An Effective Method for Measuring Elastic Modulus of Large TFT-LCD Panels
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A Development of Optimization Tool for Mechanical Shock Proof Design of a Digital Display Panel
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Measurement of Residual Stress in PDP Glass by Chemical Etching Method
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Imaging of Defects in Thin Plate by Scanning of Laser-Generated Focused-Lamb Waves
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Detection of Micro-Delamination in Electronic Packaging by Using the Ultrasonic Nonlinearity

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Periodical:

Key Engineering Materials (Volumes 270-273)

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1761-1766

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.270-273.1761

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Online since:

August 2004

Authors:

Kyung Young Jhang, Job Ha, Hyo Seong Jang

Keywords:

Electronic Package, Micro-Delamination, Reliability, Scanning Acoustic Microscope SAM, Ultrasonic Nonlinearity

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References

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DOI: 10.1007/978-1-4615-2848-7_93

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