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HomeKey Engineering MaterialsKey Engineering Materials Vols. 270-273Full-Field Measurement of Deformation of Recycled...

Full-Field Measurement of Deformation of Recycled Paper Using Electronic Speckle Pattern Interferometry

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Advances in Nondestructive Evaluation

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Periodical:

Key Engineering Materials (Volumes 270-273)

Pages:

686-689

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.270-273.686

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Online since:

August 2004

Authors:

Eisaku Umezaki, Jyunnosuke Takakuwa

Keywords:

Deformation, Electronic Speckle Pattern Interferometry (ESPI), Recycled Paper, Speckle, Speckle Pattern Interferometry, Strain, Virgin Pulp Paper

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© 2004 Trans Tech Publications Ltd. All Rights Reserved

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Citation:

[1] Shigyo Taimususha (Ed. ): Recycle of Paper and Recycled Paper (in Japanese), (Shigyo Taimususha, Tokyo 1992).

[2] Oji Paper (Ed. ): Actual Knowledge of Paper and Pulp (in Japanese), (Toyo Keizai, Tokyo 2001).

[3] Oji Paper (Ed. ): 100 newest knowledge of recycling of paper (in Japanese), (Tokyo Syoseki, Tokyo 1998).

[4] H. Komiya: Book of Paper (in Japanese), (Nikkan Kogyo Shimbun, Tokyo 2001). (m strain) (m strain) (m strain) (m strain) (m strain) (m strain) (m strain) (a) Position A (b) Position B (c) Position C (d) Position D (e) Position E (f) Position F (g) Position G Fig. 6. Strain, εy, maps of recycled paper (RP-MD0°).

DOI: 10.1021/acs.nanolett.9b03421.s001