Investigation of the Effect of Crack Closure Stress on Microwave Dual Frequency Technique for Evaluation of Small Cracks

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Periodical:

Key Engineering Materials (Volumes 270-273)

Edited by:

Seung-Seok Lee, Dong-Jin Yoon, Joon-Hyun Lee and Sekyung Lee

Pages:

913-920

DOI:

10.4028/www.scientific.net/KEM.270-273.913

Citation:

M. Saka et al., "Investigation of the Effect of Crack Closure Stress on Microwave Dual Frequency Technique for Evaluation of Small Cracks", Key Engineering Materials, Vols. 270-273, pp. 913-920, 2004

Online since:

August 2004

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$35.00

[1] W. Elber: Engineering Fracture Mechanics Vol. 2 (1970), p.37.

[2] O. Buck and B.J. Skillings: Review of Progress in Quantitative Nondestructive Evaluation, New York (1982).

[3] R. Clark, W.D. Dover and L.J. Bond: NDT International Vol. 20 (1987), p.269.

[4] K.K. So and A.N. Sinclair: Nondestructive Testing Communication Vol. 3 (1987), p.67.

[5] M. Saka, E. Schneider and P. Hoeller: Research in Nondestructive Evaluation Vol. 1 (1989), p.65.

[6] R.J. Hruby and L. Feinstein: The Review of Scientific Instruments Vol. 41 (1970), p.679.

[7] B.A. Auld: Physics in Technology Vol. 12 (1981), p.149.

[8] C.Y. Yeh and R. Zoughi: Materials Evaluation Vol. 53 (1995), p.496.

[9] N. Qaddoumi, E. Ranu, J.D. McColskey, R. Mirshahi and R. Zoughi: Research in Nondestructive Evaluation Vol. 12 (2000), p.87.

[10] Y. Ju, M. Saka, D. Luo and H. Abé: 10th Asia-Pacific Conference on Non-Destructive Testing (CD-ROM), Brisbane (2001), Paper 996.

[11] M. Saka, Y. Ju, D. Luo and H. Abé: JSME International Journal A Vol. 45 (2002), p.573.

[12] M. Saka, Y. Ju, Y. Uchimura and T. Miyadu: Key Engineering Materials, Vol. 261 (2004), p.955.

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