Investigation of the Effect of Crack Closure Stress on Microwave Dual Frequency Technique for Evaluation of Small Cracks

Masumi Saka; Toru Miyadu; Yang Ju

doi:10.4028/www.scientific.net/KEM.270-273.913

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Investigation of the Effect of Crack Closure Stress on Microwave Dual Frequency Technique for Evaluation of Small Cracks

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Key Engineering Materials (Volumes 270-273)

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913-920

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https://doi.org/10.4028/www.scientific.net/KEM.270-273.913

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Online since:

August 2004

Authors:

Masumi Saka, Toru Miyadu, Yang Ju

Keywords:

Closure Stress, Crack, Dual Frequency, Evaluation, Micro-Wave

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