Study of the Technology of Chemical Copper Plating on Al-CuO Agglomerated Powders

Abstract:

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This research focus on the technology of copper chemical plating on Al-CuO agglomerated powders with the size of 150-200µm. Orthogonal design is employed to gain the optimized formula, and the quality of the cladding was analyzed by means of SEM and EPMA. The results show that the cladding is uniform and the Al-CuO powders are primarily coated by copper.

Info:

Periodical:

Key Engineering Materials (Volumes 280-283)

Edited by:

Wei Pan, Jianghong Gong, Chang-Chun Ge and Jing-Feng Li

Pages:

591-592

DOI:

10.4028/www.scientific.net/KEM.280-283.591

Citation:

J. Yan et al., "Study of the Technology of Chemical Copper Plating on Al-CuO Agglomerated Powders", Key Engineering Materials, Vols. 280-283, pp. 591-592, 2005

Online since:

February 2007

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Price:

$35.00

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