Study of the Technology of Chemical Copper Plating on Al-CuO Agglomerated Powders

Jun Yan; Jian Zheng Yi; Hai Ping Cui; Xin Kang Du; Jian Jiang Wang

doi:10.4028/www.scientific.net/KEM.280-283.591

Paper Titles

The Preparation of Anodic Aluminum Oxide Ceramic Template and the Fabrication of Silver Nanowires
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Fabrication and Spectroscopic Investigation of La₂Hf₂O₇-Based Phosphors
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Novel Process for Synthesizing Nano-Ceramics Powder: Mechanical & Thermal Activation Processing
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Preparation of MgAl₂O₄ Nanopowder by Homogeneous Precipitation Method
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Study of the Technology of Chemical Copper Plating on Al-CuO Agglomerated Powders
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Nanostructured Surface Coating Layer of Calcium Carbonate Composite Particles
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Preparation and Characterization of Anisotropic Ammonium Titanium Phosphate Crystals via Hydrothermal Route
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Biomimetic Synthesis of CaCO₃ Particles with Specific Size and Morphology
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Study on the Synthetic Process of Calcium Borate
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HomeKey Engineering MaterialsKey Engineering Materials Vols. 280-283Study of the Technology of Chemical Copper Plating...

Study of the Technology of Chemical Copper Plating on Al-CuO Agglomerated Powders

Abstract:

This research focus on the technology of copper chemical plating on Al-CuO agglomerated powders with the size of 150-200µm. Orthogonal design is employed to gain the optimized formula, and the quality of the cladding was analyzed by means of SEM and EPMA. The results show that the cladding is uniform and the Al-CuO powders are primarily coated by copper.