Thermal Stresses in SiC-Si3N4 Cubic-Cell-Divided Multi-Particle-Matrix System

L. Ceniga

doi:10.4028/www.scientific.net/KEM.290.320

Paper Titles

Determination of Dynamic Fracture Toughness of Si₃N₄ Ceramics by Instrumented Impact Test
p.304

Determination of Fracture Toughness and Fracture Probability of LPS Aluminas by Hertzian Indentation
p.308

Low Cost SiAlON from Pyrophyllite with High Hardness and Good Corrosion Resistance
p.312

Indentation Testing of an Al₂O₃/Al₂O₃ + ZrO₂ Layered Composite
p.316

Thermal Stresses in SiC-Si₃N₄ Cubic-Cell-Divided Multi-Particle-Matrix System
p.320

Fracture Behaviour of Pressureless Sintered Nickel-Reinforced Alumina Composites
p.324

Residual Stress Profile Determined by Piezo-Spectroscopy in Alumina/Alumina-Zirconia Layers Separated by a Compositionally Graded Intermediate Layer
p.328

Mechanical Properties of Alumina/Zirconia Functionally Graded Material Prepared by Electrophoretic Deposition
p.332

Mechanical Properties of Thermal Barrier Coatings at Room Temperature
p.336

HomeKey Engineering MaterialsKey Engineering Materials Vol. 290Thermal Stresses in SiC-Si3N4 Cubic-Cell-Divided...

Thermal Stresses in SiC-Si₃N₄ Cubic-Cell-Divided Multi-Particle-Matrix System

Abstract:

The paper deals with crack formation of thermal stresses in an isotropic multi-particle-matrix system of homogeneously distributed spherical particles in an infinite matrix divided to cubic cells containing a central particle. Originating during a cooling process as a consequence of the difference in thermal expansion coefficients between a matrix and a particle, the thermal stresses are thus investigated within the cubic cell and extreme at the critical particle volume fraction. Resulting from the derived crack formation condition related to an ideal-brittle particle, the critical particle radius considering the critical particle volume fraction is presented along with an application to the thermalstress- strengthened SiC-Si3N4 ceramics.

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Key Engineering Materials (Volume 290)

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320-323

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.290.320

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July 2005

Authors:

L. Ceniga

Keywords:

Si-Ceramics, Thermal Stress

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