Signal Analysis of Acoustic Emission for Laser Imitating Grinding Burn

Abstract:

Grinding burn is a common phenomenon of thermal damage that has been one of the main constraints in grinding in respect of high efficiency and quality. Use of acoustic emission technique for identifying grinding burn was reported before. However, the AE features of grinding burn are relatively weak and easily merged by other AE sources. This paper presents an investigation of the AE features of the thermal expansion induced by laser irradiation, which was designed to simulate grinding thermal behaviour. By means of the wavelet packet transforms, AE features at the grinding burn temperature can successfully be extracted without other mechanical interferential factors. These clean features can provide a firm foundation for analysing the real grinding burn AE features and for monitoring grinding burn.

• Periodical: Key Engineering Materials (Volumes 291-292)
• Pages: 91-96
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.291-292.91
• Online since: August 2005
• Authors: Xun Chen, Q.S. Liu, Nabil Gindy
• Keywords: Acoustic Emission (AE), Feature Representation, Grinding Burn

References

[1] R. Coman, I. D. Marinescu, et al.: Abrasives Dec/Jan (1999), pp.5-6.

[2] M. Chen, and B. Y. Xue: American Society of Mechanical Engineers, Manufacturing Engineering Division, MED Manufacturing Science and Engineering - 1999 (The ASME International Mechanical Engineering Congress and Exhibition), Nov 14-Nov 19 1999, Nashville, TN, USA, ASME, Fairfield, NJ, USA. (1999).

[3] K. M. Holford: Strain Vol. 36 (2000), pp.51-54.

[4] P. R. De Aguiar, and J. F. G. De Oliveira: Abrasives, (Dec 1998/Jan 1999), pp.8-11.

[5] Z. Wang, P. Willett, et al: International Journal of Machine Tools and Manufacture, Vol. 41 (2001), pp.283-309.

[6] X. Chen, Q. Liu: Proceedings of the 3rd International Conference and Exhibition on Design and Manufacturing of Die and Molds and the 7 th International Symposium on Advances in Abrasive Technology, ISAAT 2004 - 66, Bursa, TURKEY - June 17-19, 2004, pp.461-469.

[7] X. Li: International Journal of Machine Tools and Manufacture, Vol. 42 (2002), pp.157-165.

[8] X. Li and J. Wu: Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture, Vol. 214 (2000), pp.421-424.

[9] Maradei, C., R. Piotrkowski, et al.: Insight: Non-Destructive Testing and Condition Monitoring, Vol. 44 (2002), pp.786-791.

[10] W. J. Staszewski and K. M. Holford: Key Engineering Materials, Vol. 204-205 (2001), pp.351-358.

[11] W. M. Steen: Laser material processing (Springer. London, 2003).

[12] D. Royer and E. Dieulesaint: Elastic Waves in Solids I, II. (Springer-Verlag Berlin Heidelberg. New York, 2000).

[13] S. G. Mallat, A wavelet tour of signal processing, (2nd ed. Academic Press. San Diego, London, 1999).