Detection of Cracks Using Piezoelectric Wafer Active Sensors
The capability of piezoelectric wafer active sensors to identifying cracks which are common to metallic structural elements subjected to fatigue loading were explored. A number of laboratory tests were performed to investigate Lamb wave transmission and reception characteristics as well as the sensitivity of the transmitted and reflected signals to the presence of a through-the-thickness crack of various length and orientation in a thin plate. Based on the laboratory tests an optimum strategy for crack detection with the pulse-echo method was investigated. The method can be used for large areas scanning with a small amount of sensors and is favoured for embedded and leave-in-place sensor applications.
W.M. Ostachowicz, J.M. Dulieu-Barton, K.M. Holford, M. Krawczuk and A. Zak
A. Blazewicz et al., "Detection of Cracks Using Piezoelectric Wafer Active Sensors ", Key Engineering Materials, Vols. 293-294, pp. 201-206, 2005