Detection of Cracks Using Piezoelectric Wafer Active Sensors

Antoni Blazewicz; Andrei G. Kotousov; Frank Wornle

doi:10.4028/www.scientific.net/KEM.293-294.201

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Data Mining for Fault Diagnosis and Machine Learning for Rotating Machinery
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Vibration Based Modal Parameters Identification and Wear Fault Diagnosis Using Laplace Wavelet
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Detection of Fatigue Crack Growth in Aircraft Landing Gear, 4 Point Bend Test Specimens
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Detection of Cracks Using Piezoelectric Wafer Active Sensors
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Theoretical Models and Experimental Techniques in Nondestructive Evaluation of Concrete
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Modal Analysis of Acoustic Emission Signals from Artificial and Fatigue Crack Sources in Aerospace Grade Steel
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HomeKey Engineering MaterialsKey Engineering Materials Vols. 293-294Detection of Cracks Using Piezoelectric Wafer...

Detection of Cracks Using Piezoelectric Wafer Active Sensors

Abstract:

The capability of piezoelectric wafer active sensors to identifying cracks which are common to metallic structural elements subjected to fatigue loading were explored. A number of laboratory tests were performed to investigate Lamb wave transmission and reception characteristics as well as the sensitivity of the transmitted and reflected signals to the presence of a through-the-thickness crack of various length and orientation in a thin plate. Based on the laboratory tests an optimum strategy for crack detection with the pulse-echo method was investigated. The method can be used for large areas scanning with a small amount of sensors and is favoured for embedded and leave-in-place sensor applications.

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Periodical:

Key Engineering Materials (Volumes 293-294)

Pages:

201-206

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.293-294.201

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Online since:

September 2005

Authors:

Antoni Blazewicz, Andrei G. Kotousov, Frank Wornle

Keywords:

Crack Detection, Echo-Pulse Method, Lamb Wave, Piezoelectric Wafer Sensors, Sensor Measurement Strategies

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