Detection of Cracks Using Piezoelectric Wafer Active Sensors

Abstract:

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The capability of piezoelectric wafer active sensors to identifying cracks which are common to metallic structural elements subjected to fatigue loading were explored. A number of laboratory tests were performed to investigate Lamb wave transmission and reception characteristics as well as the sensitivity of the transmitted and reflected signals to the presence of a through-the-thickness crack of various length and orientation in a thin plate. Based on the laboratory tests an optimum strategy for crack detection with the pulse-echo method was investigated. The method can be used for large areas scanning with a small amount of sensors and is favoured for embedded and leave-in-place sensor applications.

Info:

Periodical:

Key Engineering Materials (Volumes 293-294)

Edited by:

W.M. Ostachowicz, J.M. Dulieu-Barton, K.M. Holford, M. Krawczuk and A. Zak

Pages:

201-206

DOI:

10.4028/www.scientific.net/KEM.293-294.201

Citation:

A. Blazewicz et al., "Detection of Cracks Using Piezoelectric Wafer Active Sensors ", Key Engineering Materials, Vols. 293-294, pp. 201-206, 2005

Online since:

September 2005

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Price:

$35.00

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