Room Temperature Creep and Its Influence on Fatigue Crack Growth in a 304 Stainless Steel

Jie Zhao; Tao Mo; Weixing Chen; Fu Gang Wang

doi:10.4028/www.scientific.net/KEM.297-300.1083

Paper Titles

Crack Growth Simulation of Arbitrarily Shaped 3D Cracks Using Finite Element Alternating Method
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Method for Determining a Polynomial Constitutive Equation with Temperature and Strain-Rate Dependence by the AIC
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Influence of Stress Parallel to Crack Plan on Subcritical Crack Propagation in Glass under Biaxial Stress
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Applied Research of Fracture for Brass in Extra-Low Cycle Inverse Rotating Bending Fatigue
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Room Temperature Creep and Its Influence on Fatigue Crack Growth in a 304 Stainless Steel
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Evaluation of the Fretting Fatigue Behavior of Ti-6Al-4V Alloy
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A Study on the Failure Analysis of Turbine Blade under Fatigue Load Using X-Ray Fractography
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Microstructure and Creep Behavior of BN/Al (-Mg) Metal Matrix Composite
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Research on Microstructures of Alloyed Layer by Plasma Surface Alloying with Tungsten and Molybdenum
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HomeKey Engineering MaterialsKey Engineering Materials Vols. 297-300Room Temperature Creep and Its Influence on...

Room Temperature Creep and Its Influence on Fatigue Crack Growth in a 304 Stainless Steel

Abstract:

The current paper investigated the phenomena of room temperature creep at the crack tip and its influence on fatigue crack growth behavior of a 304 stainless steel. From the experiments, a time-dependent deformation is obviously observed under various stress intensity factors. The deformation depends on stress intensity factor as well as load history. Both acceleration and retardation of fatigue crack growth are found after room temperature creep, which rest on load patterns. A distinct marking line was seen on the fracture surface following the holding period. It is proposed that the crack propagation mode changed after the hold time.

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Periodical:

Key Engineering Materials (Volumes 297-300)

Pages:

1083-1088

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.297-300.1083

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Online since:

November 2005

Authors:

Jie Zhao, Tao Mo, Weixing Chen, Fu Gang Wang

Keywords:

Acceleration, Fatigue Crack Growth (FCG), Retardation, Room Temperature Creep

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