Influence of Surface Finish of Cu Electrode on Shear Strength and Microstructure of Solder Joint with Sn-3Ag-0.5Cu

Ikuo Shohji; Hiroki Goto; Kiyotomo Nakamura; Toshikazu Ookubo

doi:10.4028/www.scientific.net/KEM.297-300.2864

Paper Titles

The Effect of Vacuum Thermal Cycling on LF6 Aluminium Alloy Welded Joints
p.2843

Effects of Sea Water Immersion and Temperature on the Strength of Spot-Welded Steel Plates
p.2847

Evaluation of Mechanical Properties for Narrow-Gap Weld Zone in Reactor Coolant Loop
p.2853

Effects of Current and Voltage on Welding Strength of Lap Joint with CO₂ Welding Process
p.2859

Influence of Surface Finish of Cu Electrode on Shear Strength and Microstructure of Solder Joint with Sn-3Ag-0.5Cu
p.2864

Chemical Shrinkage and Residual Stresses in Laminated Composites during Cure
p.2870

Effect of Process Variables on Microstructure and Mechanical Properties of Wide-Gap Brazed IN738 Superalloy
p.2876

Evaluation of Fatigue Strength and Spot Weldability of High Strength Steel Sheet for Light Weight Automobile Body
p.2883

The Cause Examination of the Crack of the End Beam for Welding Structure Type Bogie
p.2888

HomeKey Engineering MaterialsKey Engineering Materials Vols. 297-300Influence of Surface Finish of Cu Electrode on...

Influence of Surface Finish of Cu Electrode on Shear Strength and Microstructure of Solder Joint with Sn-3Ag-0.5Cu

Abstract:

An influence of a surface finish of a Cu electrode on joint properties of a lead-free solder joint with Sn-3mass%Ag-0.5mass%Cu has been investigated. As the surface treatment method, Ni/Au electroplating, Au electroplating and organic solderability preservative (OSP) treatments were conducted to Cu electrodes. A heat exposure treatment was conducted at 150°C up to 500h in order to investigate the reliability of the solder joint under heat exposure conditions. Ball shear test was performed to examine joint strength. Microstructural observation was conducted to investigate growth kinetics of a reaction layer formed at a joint interface and microstructural revolution in the solder layer.

You might also be interested in these eBooks

View Preview

Info:

Periodical:

Key Engineering Materials (Volumes 297-300)

Pages:

2864-2869

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.297-300.2864

Citation:

Cite this paper

Online since:

November 2005

Authors:

Ikuo Shohji, Hiroki Goto, Kiyotomo Nakamura, Toshikazu Ookubo

Keywords:

Growth Kinetic, Interface Reaction, Lead-Free Solder, Microstructure, Shear Strength, Sn-3Ag-0.5Cu

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

References

[1] I. Shohji, T. Yoshida, T. Takahashi and S. Hioki: Mater. Sci. and Eng. A366 (2004), p.50.

Google Scholar

[2] M. McCormack, S. Jin, G.W. Kammlott and H.S. Chen: Appl. Phys. Lett. Vol. 63 (1993), p.15.

Google Scholar

[3] Y. Kariya and M. Otsuka: J. Electron. Mater. Vol. 27 (1998), p.866.

Google Scholar

[4] Y. Kariya and M. Otsuka: J. Electron. Mater. Vol. 27 (1998), p.1229.

Google Scholar

[5] C.B. Lee, S.J. Suh, Y.E. Shin, C.C. Shur and S.B. Jung: Proc. of Mate, Microjoining and Assembly Technology in Electronics (2002), p.351.

Google Scholar

[6] M. Nishiura, A. Nakayama, S. Sakatani, Y. Kohara, K. Uenishi and K.F. Kobayashi: Mater. Trans. Vol. 43 (2002), p.1802.

DOI: 10.2320/matertrans.43.1802

Google Scholar

[7] Y. Chonan, T. Komiyama, J. Onuki, R. Urao, T. Kimura and T. Nagano: Mater. Trans. Vol. 43 (2002), p.1840.

Google Scholar

[8] C.B. Lee, S.B. Jung, Y.E. Shin and C.C. Shur: Mater. Trans. Vol. 43 (2002), p.1858.

Google Scholar

[9] M. Ito, M. Yoshikawa, Y. Nakagawa, G. Katagiri, T. Hiramori, A. Hirose and K.F. Kobayashi: Proc. of Mate, Microjoining and Assembly Technology in Electronics (2003), p.277.

Google Scholar

[10] T. Hiramori, M. Ito, Y. Tanii, A. Hirose and K.F. Kobayashi: Proc. of Mate, Microjoining and Assembly Technology in Electronics (2003), p.283.

Google Scholar

[11] K. Uenishi, Y. Kohara, S. Sakatani and K.F. Kobayashi: Proc. of Mate, Microjoining and Assembly Technology in Electronics (2003), p.289.

Google Scholar

[12] M. Ito, Y. Tanii, T. Ito, Y. Nakagawa, G. Katagiri, T. Hiramori, A. Hirose and K.F. Kobayashi: Proc. of Mate, Microjoining and Assembly Technology in Electronics (2004), p.159.

Google Scholar

[13] T. Hiramori, M. Ito, Y. Tanii, A. Hirose and K.F. Kobayashi: Proc. of Mate, Microjoining and Assembly Technology in Electronics (2004), p.165.

Google Scholar

[14] K. Uenishi, T. Saeki, Y. Kohara, K.F. Kobayashi, I. Shoji, M. Nishiura and M. Yamamoto: Mater. Trans. Vol. 42 (2001), p.756.

Google Scholar

[15] T.B. Massalski: Binary Alloy Phase Diagram (ASM International, USA 1990).

Google Scholar