Boundary Element Analysis of an Interface Crack in a Bonded Viscoelastic Thin Film

Abstract:

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Interfacial stress singularities induced in a laminate model consisting of the viscoelastic thin film and the elastic substrate have been investigated using the time-domain boundary element method. First, the interfacial singular stresses between the viscoelastic thin film and the elastic substrate subjected to a uniform moisture ingression have been investigated near the free surface, but without any edge crack. The thin film is assumed to be a linear viscoelastic material and moisture effects are assumed to be analogous to thermal effects. Then, the overall stress intensity factor for the case of a small interfacial edge crack of length a has been computed. The numerical procedure does not permit calculation of the limiting case for which the edge crack length vanishes.

Info:

Periodical:

Key Engineering Materials (Volumes 297-300)

Edited by:

Young-Jin Kim, Dong-Ho Bae and Yun-Jae Kim

Pages:

703-709

DOI:

10.4028/www.scientific.net/KEM.297-300.703

Citation:

S. S. Lee and M. H. Yi, "Boundary Element Analysis of an Interface Crack in a Bonded Viscoelastic Thin Film ", Key Engineering Materials, Vols. 297-300, pp. 703-709, 2005

Online since:

November 2005

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Price:

$35.00

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