Boundary Element Analysis of an Interface Crack in a Bonded Viscoelastic Thin Film

Abstract:

Interfacial stress singularities induced in a laminate model consisting of the viscoelastic thin film and the elastic substrate have been investigated using the time-domain boundary element method. First, the interfacial singular stresses between the viscoelastic thin film and the elastic substrate subjected to a uniform moisture ingression have been investigated near the free surface, but without any edge crack. The thin film is assumed to be a linear viscoelastic material and moisture effects are assumed to be analogous to thermal effects. Then, the overall stress intensity factor for the case of a small interfacial edge crack of length a has been computed. The numerical procedure does not permit calculation of the limiting case for which the edge crack length vanishes.

• Periodical: Key Engineering Materials (Volumes 297-300)
• Pages: 703-709
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.297-300.703
• Online since: November 2005
• Authors: Sang Soon Lee, Mi Hie Yi
• Keywords: Interface Edge Crack, Moisture, Singular Stresses, Thin Film, Viscoelasticity

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