Development of Grinding Temperature Measuring System Considering Compensation of Thermocouple Dynamic Responding Error

Hang Gao; Ren Ke Kang; Dong Ming Guo; Jian Li

doi:10.4028/www.scientific.net/KEM.304-305.127

Paper Titles

Researches on Dressing Diamond Grinding Wheels on Line by a Diamond Pen Aided with Laser Beam Preheating Based on Optical Fiber Delivering
p.109

Form and Texture Control of Free-Form Surface Polishing
p.113

Research on Genetic Optimization of Special Spiral Rod Grinding Process
p.118

Analysis of the Breakage of Diamond Wire Saws in Sawing of Stone
p.123

Development of Grinding Temperature Measuring System Considering Compensation of Thermocouple Dynamic Responding Error
p.127

Analysis on Surface Temperature Field of Ultra-High Speed Grinding
p.131

Analysis and Study of the Influence Factor on the Airflow of Ultra-Speed Grinding Wheel
p.136

Nonlinear Stability and Bifurcation of Multi-D.O.F. Chatter System in Grinding Process
p.141

Study on the Virtual Wheel and Grinding Process
p.146

HomeKey Engineering MaterialsKey Engineering Materials Vols. 304-305Development of Grinding Temperature Measuring...

Development of Grinding Temperature Measuring System Considering Compensation of Thermocouple Dynamic Responding Error

Abstract:

In order to improve grinding temperature measuring precision the compensation method of thermocouple dynamic response errors and the modification method of non-linearity of thermocouple characteristic curve were analyzed and then programmed with VC++ language. Further more a grinding temperature measuring system was developed by means of second development of 10612CF type of TOP DAC (data acquiring card) with LabWindows/CVI, which provides three kinds of estimating thermocouple time constant methods. Primary debugging results showed that the measuring system developed is simply easy to handle and can satisfy experimental study of grinding temperature.

You might also be interested in these eBooks

Advances in Grinding and Abrasive Technology XIII

View Preview

Info:

Periodical:

Key Engineering Materials (Volumes 304-305)

Pages:

127-130

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.304-305.127

Citation:

Cite this paper

Online since:

February 2006

Authors:

Hang Gao, Ren Ke Kang, Dong Ming Guo, Jian Li

Keywords:

Compensation, Dynamic Response Error, Grinding, Temperature, Thermocouple

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

References

[1] W.B. Rowe, M.N. Morgan, S.C.E. Black and B. Mills: Annals of the CIRP, Vol. 1 (1996) No. 15, p.133.

Google Scholar

[2] A.Y.C. Nee: International J.M.T.D.R., Vol. 21 (1981) No. 314, p.279.

Google Scholar

[3] Z.C. Lin, C.Q. Xu: Journal of Fuzhou University, (1981), p.1. (Chinese).

Google Scholar

[4] W.B. Xu: Mechanical and Electrical Engineering, (1990) No. 2, p.9. (Chinese).

Google Scholar

[5] W.X. Luo, H.X. Liu: Journal of Petroleum University, Vol. 19 (1995) No. 5, p.102. (Chinese) Fig. 3 Input interface of thermocouple parameters Fig. 4 Modification of temperature with LQM.

Google Scholar